Precision tooling and mold development capability supporting high-cavity semiconductor component production through integrated design, machining, and assembly processes.
CNC · EDM · Wire cutting · Precision grinding · High-cavity mold capability up to 256 cavities
Precision tooling and mold development capability supporting high-cavity semiconductor component production. In-house design, machining, and assembly enabling integrated control from mold concept to mass production.
High-speed CNC machining for mold cavity and core components with controlled surface finish and dimensional accuracy.
Electrical discharge machining for complex cavity geometries and micro-features requiring controlled spark erosion.
Wire EDM for precision die components, punch profiles, and tight-tolerance tooling elements.
Surface and profile grinding for mold components, die inserts, and precision assemblies.
Instrument design and product/mold design capability supporting high-cavity LED and semiconductor molds.
Mold assembly, grinding work, and validation ensuring production-ready tooling performance.
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