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Semiconductor Lead Frame Formats & Extended Component Portfolio

Representative component formats developed across semiconductor lead frame, precision stamping, and insert molded component programs.

This portfolio includes representative semiconductor lead frame formats, insert molded components, and stamped structures developed for OEM and OSAT programs across semiconductor and electronic manufacturing applications.

Formats support fine pitch configurations and high-density electronic packaging requirements.

Showing representative component formats across semiconductor and electronic applications

Representative formats developed for global programs. Specific designs are customized based on application requirements.

Lead Frame Formats

QFN Lead Frame

Compact lead frame format for high-density semiconductor packaging.

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Applications
• IC packaging (QFN devices)
• Compact electronic modules
Features
• Fine pitch lead configuration
• High-density layout capability
• Stable dimensional control
Materials
• Copper alloys
• Ni / Ag / Au plating options

QFP Lead Frame

Multi-lead frame format for integrated circuit packaging.

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Applications
• Microcontrollers
• Consumer electronics ICs
Features
• Peripheral lead configuration
• Consistent lead spacing
• Suitable for automated assembly
Materials
• Copper alloys
• Selective plating systems

TSOP Lead Frame

Thin small-outline lead frame for memory and compact IC applications.

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Applications
• Memory devices
• Thin electronic modules
Features
• Thin profile design
• Fine pitch leads
• Stable flatness control
Materials
• Copper alloys
• Tin / Nickel plating

TSSOP Lead Frame

Thin shrink small-outline lead frame for high-density IC packaging.

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Applications
• Compact IC devices
• Consumer electronics
Features
• Reduced pitch configuration
• Thin profile geometry
• High-density lead arrangement
Materials
• Copper alloys
• Multi-layer plating options

SOIC Lead Frame

Standard outline lead frame for general-purpose IC applications.

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Applications
• Analog ICs
• Standard electronic modules
Features
• Standardized geometry
• Reliable lead spacing
• Consistent manufacturing output
Materials
• Copper alloys
• Tin-based plating

SOP Lead Frame

Small outline package lead frame for compact electronic assemblies.

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Applications
• Consumer electronics
• Embedded systems
Features
• Compact footprint
• Controlled lead geometry
• Suitable for automated production
Materials
• Copper alloys
• Nickel / Tin plating

DIP Lead Frame

Dual in-line lead frame for through-hole electronic applications.

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Applications
• Through-hole PCB assemblies
• Industrial electronics
Features
• Robust lead structure
• Larger pitch configuration
• High mechanical stability
Materials
• Copper alloys
• Tin plating

Flip Chip Lead Frame

Lead frame structure for flip-chip semiconductor packaging.

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Applications
• High-performance IC packaging
• Advanced semiconductor devices
Features
• Direct die attach compatibility
• Fine pitch interconnects
• High-density configuration
Materials
• Copper alloys
• Gold / Nickel plating

Insert Molded / Functional Components

Premold Lead Frames

Pre-encapsulated lead frames for semiconductor packaging.

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Applications
• Semiconductor packaging
• Integrated device structures
Features
• Pre-molded structure
• Improved handling stability
• Reduced assembly complexity
Materials
• Engineering polymers (LCP, PPS)
• Copper lead frames

Connector Lead Frames

Precision lead frame structures for electrical connector systems.

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Applications
• Electrical connectors
• Signal transmission systems
Features
• Controlled contact geometry
• Stable electrical interface
• High repeatability
Materials
• Copper alloys
• Selective plating

Sensor Lead Frame Structures

Lead frame structures designed for sensor integration applications.

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Applications
• Environmental sensors
• Automotive sensing systems
Features
• Sensor-compatible geometries
• Stable dimensional output
• Integration-ready structure
Materials
• Copper alloys
• Plated surfaces

Micro-Precision Interface Components

Micro-scale insert molded components for sensor and interface applications.

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Applications
• Micro-precision sensors
• Micro-actuators
Features
• Micro-geometry precision
• Stable molding conditions
• High repeatability
Materials
• High-performance polymers (LCP, PPS)
• Metal inserts

Special / Advanced Components

DR-QFN Structures

Advanced QFN structures for high-performance semiconductor applications.

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Applications
• High-density IC packaging
• Advanced semiconductor modules
Features
• Enhanced thermal performance
• Optimized lead structure
• High-density configuration
Materials
• Copper alloys
• Advanced plating systems

Fusion Quad Lead Frames

Multi-section lead frame structures for complex IC packaging.

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Applications
• Multi-chip modules
• Advanced IC assemblies
Features
• Integrated multi-section design
• Stable structural alignment
• Complex geometry capability
Materials
• Copper alloys
• Multi-layer plating

Custom Geometry Lead Frames

Application-specific lead frame designs for unique requirements.

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Applications
• Custom semiconductor devices
• Specialized electronic components
Features
• Flexible geometry design
• Adaptable to application needs
• High precision manufacturing
Materials
• Copper alloys
• Application-specific plating

Hybrid Metal-Plastic Components

Integrated metal and plastic components for functional applications.

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Applications
• Electronic assemblies
• Sensor and connector systems
Features
• Metal-plastic integration
• Structural and functional combination
• Stable interface performance
Materials
• Engineering polymers
• Metal inserts

Wide Format Range

Supporting multiple semiconductor packaging standards

Adaptable Engineering

Customized component development

Scalable Production

Volume manufacturing through established systems

Discuss Your Component Format Requirements

For precision electronics and semiconductor component programs.

Share Your Requirement

For injection molding: Moldrite India →