SMD 160P semiconductor test socket connectors and high pin-count chip test interface components manufactured with precision insert molding for IC testing, validation, and burn-in applications.
SMD test socket configurations up to 160 contacts with stable interface alignment and dimensional consistency across qualification cycles.
Test socket components include high pin-count surface-mount (SMD) connector structures designed for semiconductor validation and test interface applications, supporting fine pitch multi-contact interfaces in the sub-0.5mm class.
Supports high pin-count SMD test interface configurations used in semiconductor validation and burn-in programs, with precision insert alignment and stable dimensional control across repeated test cycles.
Precision capability defined by the insert molding and stamping processes. Refer to Insert Molding and Precision Stamping capability pages for detailed specifications.
Manufacturing integrates precision insert molding, controlled metal alignment, and multi-stage inspection to ensure stable interface alignment, dimensional repeatability, and process consistency across high pin-count test socket production. Supports MEMS-related sensor interface and micro-precision insert molded structures.
Discuss Your Test Socket Requirement
Discuss Your Test Socket RequirementPrograms are executed through Korean precision manufacturing systems, with Moldrite providing India-based program ownership and structured transition to localization as volumes scale.
Share your test socket requirements including pin count, interface type, and volume.
Discuss Your Test Socket RequirementFor injection molding: Moldrite India →
