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LED Lead Frame Components | Precision Semiconductor & Electronics Applications

Top-view, side-view, and power LED lead frames manufactured with high-cavity tooling, fine pitch control, and stable high-volume production across demanding applications.

High-cavity tooling capability up to 256 cavities (hot runner)

Discuss Your LED Lead Frame Requirement
Suitable For
Top-View LED Packaging
Side-View LED Packaging
Power LED Modules
Mini LED Backlight Structures
Insert-Molded LED Lead Frames
Semiconductor LED Packaging
Display backlight applications
Automotive lighting modules
LED lead frame strip for top-view LED packaging
Insert molded LED lead frame with fine pitch geometry
High-cavity LED lead frame array strip
Precision

Precision & Dimensional Capability

0.100–0.254mm
Material thickness range
±0.005mm
Thickness tolerance
±0.013mm
Fine pitch tolerance
0.001–0.005mm
Burr control range
±0.008mm
Flatness control
Ø0.305mm
Minimum hole diameter

Typical Production Capability

Dimensional capability maintained in production through controlled stamping, precision tooling, and multi-stage inspection systems.

Achieved through progressive stamping, precision tooling, and controlled forming processes.

Configurations

LED Lead Frame Configurations

Top-View LED Lead Frames

Surface-emitting LED packages with stable pad geometry and optical alignment for lighting and display applications.

Cavity: 128, 144, 192, 256 (Cold & Hot Runner Systems)

Side-View LED Lead Frames

Compact lead frame structures for lateral light emission in display backlight and indicator applications.

Cavity: 64, 128 · Down to 0.4T thickness

Power LED Lead Frames

Thermally stable lead frame configurations for high-power LED modules with heat slug integration.

Cavity: 36 (Cold Runner Systems) · Heat slug capable
  • Supplied into Tier-1 LED and semiconductor packaging ecosystems
  • Manufactured through established Korean precision supply chains
  • Fine pitch geometries with controlled burr formation
  • High-cavity production with stable strip-level repeatability
  • Designed for high-volume LED packaging programs
  • Reel-to-reel processing compatibility for automated LED assembly
Materials & Process

Materials & Manufacturing Process

Materials

• Copper and copper-alloy lead frames
• High-performance polymers (LCP, PPS, PPA)
• Selective plating: Ni, Ag, Au
• Heat slug materials for power LED

Processes

• Precision stamping with edge quality control
• Insert molding with metal-plastic integration
• Plating (pre- and post-mold)
• Trim & form with controlled geometry
• Automated vision inspection

Discuss Your LED Lead Frame Requirement

Discuss Your LED Lead Frame Requirement
Execution & Value

Program Execution & Value

Programs are executed through Korean precision manufacturing systems, with Moldrite providing India-based program ownership and structured transition to localization as volumes scale.

Program Execution

Korea-based tooling & LED mold development
Production through proven Korean systems
Moldrite-led program coordination

Value Delivered

20+ years LED lead frame expertise
High-volume production capability enabled by proven 256-cavity tooling
Consistent quality across high-volume repeat production

Related Components

Semiconductor Arrays

High-density panels

Test Socket & Interface

Semiconductor testing

Precision Stamping

Stamping capability

Discuss Your LED Lead Frame Requirement

Share your LED lead frame requirements including configuration, volume, and technical specifications.

Share Your Requirement

For injection molding: Moldrite India →