Controlled plating processes supporting semiconductor lead frames and precision components with selective deposition, consistent thickness, and reel-to-reel production compatibility.
Ni · Ag · Au selective plating · Reel-to-reel · Spot and ring plating methods
Controlled plating and surface treatment capability supporting semiconductor lead frames and precision electronic components with selective deposition, controlled thickness, and consistent surface quality across reel-to-reel production.
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